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2D and 3D X-ray systems can image the internal lead frame and bond wires without destroying the IC. This reveals whether the chip is a monolithic die, a multi-chip module, or simply a passive array.
The chip is frequently listed as equivalent or identical to the IC Components Key Features for Design The marking codes database cross reference search.
2D and 3D X-ray systems can image the internal lead frame and bond wires without destroying the IC. This reveals whether the chip is a monolithic die, a multi-chip module, or simply a passive array.
The chip is frequently listed as equivalent or identical to the IC Components Key Features for Design The marking codes database cross reference search.
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