Verified | Wpce773la0dg Datasheet Pdf

Integrated with chipsets like the Intel Cantiga-GM and ICH9M. Wistron Project Codes: Frequently appeared in designs such as the (Project 91.4CQ01.001). Verified Datasheet Resources

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Winbond Electronics / Nuvoton Technology Corporation America Package Type: QFP-128 (128-pin Quad Flat Package) Operating Temperature: Extended range from Integrated with chipsets like the Intel Cantiga-GM and ICH9M

The following technical details are commonly found in the WPCE773LA0DG datasheet : Winbond / Nuvoton Technology ariat-tech

The chip monitors thermal sensors and manages fan speeds to maintain safe operating temperatures. Interface Support: It utilizes the Low Pin Count (LPC) or I2Ccap I squared cap C

(now part of Nuvoton Technology). It is widely used in laptop motherboards, such as the Apple MacBook Pro A1286, to manage low-level system functions. ariat-tech.com Core Specifications Manufacturer: Winbond / Nuvoton Technology Corporation America. Package Type: (128-pin Quad Flat Package). Device Category: Integrated Circuits (ICs) / Processors / Microcontrollers. Operating Temperature: Extended range from -40°C to 105°C cap T sub cap A Lead-Free Status: RoHS Compliant. ariat-tech.com Functional Roles